XMD-MSA website

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January 17, 2006	Leading Optical Chip and Module Manufacturers Announce the Addition of Optical Devices with SC Connector Interface to (XMD) MSA for TOSA/ROSA
	CLOSE Leading Optical Chip and Module Manufacturers Announce the Addition of Optical Devices with SC Connector Interface to (XMD) MSA for TOSA/ROSA MSA Enables Multiple Vendors to Produce 10 Gbit/s Pluggable Modules Based on a Unified Standard TOKYO - Jan. 17, 2006 - Leading optical manufacturers; Avanex Corp., CyOptics, Inc., Eudyna Devices Inc., Mitsubishi Electric Corp., Oki Electric Industry Co., Ltd., Opnext, Inc. and Sumitomo Electric Industries, Ltd., today announced the release of new common specifications for optical devices including SC connector, one of a kind optical connectors, as the interface, based on a 10 Gbit/s Miniature Device Multi-Source Agreement (XMD-MSA). The XMD-MSA specifications are designed for applications from short-to-long reach transmission functions. Specifications established by the XMD-MSA enables the use of optical devices from multiple suppliers. The XMD-MSA has been created to establish compatible sources of 10 Gbit/s Transmitter Optical Sub-Assembly (TOSA) and Receiver Optical Sub-Assembly (ROSA) devices embedded into the 10 Gbit/s MSA modules, which has been designed for use in large capacity network and data storage systems. This XMD-MSA specification covers optical devices that comply with 10 Gbit/s interface standards, including 10 Gigabit Ethernet, 10 Gigabit Fiber Channel and SONET OC-192. The newly available XMD-MSA specifications details the optical devices with SC connector interface, in addition to the existing specifications pertaining to the TOSA and ROSA devices embedded into 10 Gbit/s XFP modules. The XMD-MSA specifications encompass all 10 Gbit/s pluggable modules; including XFP modules, XENPAK modules, X2 modules and XPAK modules. The specifications for interchangeable TOSA/ROSA devices include: Common Mechanical Dimensions including optical connector interface that determines the design of the 10 Gbit/s pluggable modules’ optical head Common electrical interface standards and the method to connect into pluggable module circuit using flexible printed circuit (FPC) Common optical and electrical characteristics Prior to this announcement, the MSA committee released a new revision of the TOSA/ROSA specifications issued in October, 2004. New specifications for the MSA can be available from the following XMD-MSA members. CLOSE

Sep 1, 2004	Leading Optical Chip and Module Manufacturers Announce 10 Gbit/s Miniature Device (XMD) MSA for TOSA/ROSA
	CLOSE Leading Optical Chip and Module Manufacturers Announce 10 Gbit/s Miniature Device (XMD) MSA for TOSA/ROSA MSA Enables Multiple Vendors to Produce Short- and Long- Reach TOSA/ROSA XFPs Based on a Unified Standard Tokyo, Japan, September 1, 2004: Leading Optical Manufacturers Avanex Corp., Eudyna Devices Inc., Mitsubishi Electric Corp., Oki Electric Industry Co., Ltd., Opnext, Inc., Sumitomo Electric Industries, Ltd., and TriQuint Semiconductor, Inc., today announced the release of new common specifications for long-reach optical devices based on a 10 Gbit/s Miniature Device Multi-Source Agreement (XMD-MSA). The XMD-MSA specifications are designed for applications from short-to-long reach transmission functions. Specifications established by the XMD-MSA enables the use of optical devices from multiple suppliers. The XMD-MSA has been created to establish compatible sources of 10 Gbit/s Transmitter Optical Sub-Assembly (TOSA) and Receiver Optical Sub-Assembly (ROSA) devices embedded into the 10 Gbit/s small form factor pluggable (XFP) MSA modules. The XFP module has been designed for use in large capacity network and data storage systems. This XMD-MSA covers optical devices that comply with 10 Gbit/s interface standards, including 10 Gigabit Ethernet, 10 Gigabit Fiber Channel and SONET OC-192. The newly available XMD-MSA specifications detail the semiconductor-based external modulator TOSA and Avalanche Photo-Diode Trans-Impedance Amplifier (APD-TIA) for long-reach (beyond 20 km) applications. XMD-MSA specifications now cover transmission applications for most optical networking systems. These specifications for interchangeable TOSA/ROSA devices include: Common Mechanical Dimensions including optical connector interface that determines the design of the XFP optical head Common electrical interface standards using flexible printed circuit (FPC) Optical and electrical characteristics This MSA enhances the XMD-MSA for direct-modulation Distributed-Feed-back (DFB) or Fabry-Perot (FP) laser TOSA, and the PIN Photodiode - Trans-Impedance Amplifier (PIN-TIA) ROSA for short-reach applications up to 20km, previously announced on June 7th, 2004. Members of the XMD-MSA (detailed below) can provide specifications for the new multi-source agreement. The MSA committee plans to revise TOSA/ROSA specifications issued on June 7. The revised specifications will be available on September 30 from any member of the XMD-MSA CLOSE

June 7, 2004	Leading Optical Chip and Module Manufacturers Release Common Specifications for the 10 Gbit/s Solution with a Miniature Device (XMD) MSA for XFP TOSA and ROSA
	CLOSE Leading Optical Chip and Module Manufacturers Release Common Specifications for the 10 Gbit/s Solution with a Miniature Device (XMD) MSA for XFP TOSA and ROSA MSA specifications designed to enable use of optical devices for multiple suppliers Tokyo, Japan, June 7, 2004 -- Eudyna Devices Inc., Mitsubishi Electric Corp., Oki Electric Industry Co., Ltd., Opnext, Inc. and Sumitomo Electric Industries, Ltd., today announced the release of the common specifications for optical devices based on a 10 Gbit/s Miniature Device Multi-Source Agreement (XMDMSA). The defined specifications are intended for optical devices capable of transmission over a distance of 20 km or more. The XMD-MSA enables the use of optical devices from multiple suppliers. The XMD-MSA has been created to establish compatible sources of 10 Gbit/s Transmitter Optical Sub-Assembly (TOSA) and Receiver Optical Sub-Assembly (ROSA) devices embedded into the 10 Gbit/s XFP MSA module. The XFP module has been designed for use in large-capacity network and storage systems. This XMD-MSA covers optical devices that comply with 10 Gbit/s interface standards such as 10 Gigabit Ethernet, 10 Gigabit Fiber Channel and SONET OC-192. The use of flexible printed circuits (FPC) absorbs TOSA/ROSA package design differences among suppliers. This results in the same XFP-housing structure and printed circuit board (PCB) for multi-supplier’s TOSA/ROSA. The newly available XMD-MSA specifications detail the direct-modulation Distributed-Feed-back (DFB) or Fabry-Perot (FP) laser TOSA, and the PIN Photodiode - Trans-Impedance Amplifier (PIN-TIA) ROSA. These specifications for interchangeable TOSA/ROSA devices include: Mechanical Dimensions including optical connector interface that determines the design of the XFP optical head Electrical Interface using a flexible printed circuit (FPC) Optical and electrical characteristics The specifications are now available from any member of the XMD-MSA. The XMD-MSA committee will continue to discuss the specifications for the semiconductor-based external modulator TOSA and Avalanche Photo-Diode Trans-Impedance Amplifier (APD-TIA) ROSA. CLOSE

February 23, 2004	Leading Optical Chip and Module Manufacturers Target 10 Gbit/s Solution with a Miniature Device (XMD) MSA for XFP TOSA and ROSA
	CLOSE Leading Optical Chip and Module Manufacturers Target 10 Gbit/s Solution with a Miniature Device (XMD) MSA for XFP TOSA and ROSA OFC 2004, Los Angeles Convention Center, Calif, USA - Feb. 23, 2004 - Fujitsu Quantum Devices, Ltd., Mitsubishi Electric Corp., Oki Electric Industry Co., Ltd., Opnext, Inc. and Sumitomo Electric Industries, Ltd., today announced at the Optical Fiber Communication Conference 2004 (OFC 2004) the formation of a Multi-Source Agreement (MSA) to establish compatible sources of 10Gbit/s Transmitter Optical Sub-Assembly (TOSA) and Receiver Optical Sub-Assembly (ROSA) for use in the 10 Gbit/s XFP MSA defined module. This initiative standardizes the common mechanical dimensions, footprint and pin functions of the TOSA/ROSA devices; key compact optical components used in XFP modules. “This agreement will help support the emergence of the 10 Gbit/s compact module market, providing advanced solutions to high capacity network and storage systems,” said the MSA Committee. “In the long term, all members will consolidate their current models into MSA compliant products in order to achieve lower costs and consistent customer delivery.” In order to construct the broadband internetworking infrastructure, 10 Gbit/s optical transmission interfaces are widely deployed in Metropolitan Area Network (MAN), Local Area Network (LAN) and Storage systems. There have been many efforts to establish industrial standards in optical modules resulting in the formation of several multi-source agreements (MSA) such as 300-pin MSA (www.300pinmsa.org), XENPAK (www.xenpak.org), X2 (www.x2msa.org) and XFP (www.xfpmsa.org). XFP is the most advanced MSA providing compact 10 Gbit/s modules while achieving lower power consumption at a significantly lower cost. To fulfill the requirements, the five chip and module manufactures formed a MSA for TOSA/ROSA devices to develop devices with the capability to reduce the cost and power consumption within XFP modules. The new MSA defines the direct-modulation Distributed-Feed-back (DFB)/ Fabry-Perot (FP) laser TOSA and the PIN Photodiode - Trans-impedance amplifier (PIN-TIA) ROSA complying with 10 Gbit/s interface standard of OC-192, 10GbE and 10G FC. The MSA targets 1310nm transmission modules for up to 20km applications and 1550nm transmission modules beyond 40km applications. This MSA intends to establish the compatible TOSA/ROSA as defined below: Common mechanical dimensions including the LC-receptacle parts and mechanically mounting method to XFP modules Common interface with common XFP PCB design Common pin assignment and functions Common electrical and optical characteristics The MSA is now finalizing the TOSA/ROSA specifications and working samples will be available soon in 2004. CLOSE

The latest document (updated on January 17, 2006) (Click to open)

XMD documents
	ZIP file of all document	(1110KB)

General
	"General", Rev 2.0, January 17, 2006	(26KB)

Electrical and Optical Specification of TOSA
	"Electrical & Optical Interfaces of TOSA DML", Rev1.2, January 17, 2006	(34KB)
	"Electrical & Optical Interfaces of TOSA EMwL", Rev1.2, January 17, 2006	(33KB)

Physical Specification of TOSA
	"Physical Interface of LC TOSA Type 1 Package", Rev.2.1 January 17, 2006	(129KB)
	"Physical Interface of LC TOSA Type 2 Package", Rev.1.2 January 17, 2006	(125KB)
	"Physical Interface of SC TOSA Type 1 Package", Rev.1.0 January 17, 2006	(128KB)
	"Physical Interface of SC TOSA Type 2 Package", Rev.1.0 January 17, 2006	(124KB)

Electrical and Optical Specification of ROSA
	"Electrical & Optical Interfaces of ROSA PIN", Rev.1.2 January 17, 2006	(34KB)
	"Electrical & Optical Interfaces of ROSA APD", Rev.1.2 January 17, 2006	(29KB)

Physical Specification of ROSA
	"Physical Interface of LC ROSA Type 1 Package",Rev.2.1 January 17, 2006	(129KB)
	"Physical Interface of LC ROSA Type 2 Package", Rev.1.2 January 17, 2006	(129KB)
	"Physical Interface of SC ROSA Type 1 Package", Rev.1.0 January 17, 2006	(129KB)
	"Physical Interface of SC ROSA Type 2 Package", Rev.1.0 January 17, 2006	(129KB)

Member Companies and Representatives (Click a representative name to contact)

Avanex Corp.	Pierre Wolkowicz

CyOptics, Inc.	Len J.P. Ketelsen

Eudyna Devices Inc.	Hajime Shoji

Mitsubishi Electric Corp.	Hitoshi Watanabe

Oki Electric Industry Co., Ltd.	Yasunari Mizuguchi

Opnext, Inc.	Atsushi Takai

Sumitomo Electric Industries, Ltd.	Yutaka Matsumura

UPDATED on JAN 17, 2006
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